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| Large-scale Growth of Copper Oxide Nanowires on Various Copper Substrates 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2013, 卷号: 29, 期号: 12, 页码: 1156-1160
作者: Yue Yumei; Chen Mingji; Ju Yang; Wang Shuai
  收藏 | 浏览/下载：109/0 | 提交时间：2021/02/26
CUO NANOWIRES DECOMPOSITION OXIDATION MECHANISM NANORODS ROUTE Copper oxide nanowires Stress-induced method Gradual cooling process Copper-containing substrate |
| Growth Mechanism of Single-Walled Carbon Nanotubes on Iron-Copper Catalyst and Chirality Studies by Electron Diffraction 期刊论文
Chemistry of Materials, 2012, 卷号: 24, 期号: 10, 页码: 1796-1801
作者: M. S. He; B. L. Liu; A. I. Chernov; E. D. Obraztsova; I. Kauppi; H. Jiang; I. Anoshkin; F. Cavalca; T. W. Hansen; J. B. Wagner; A. G. Nasibulin; E. I. Kauppinen; J. Linnekoski; M. Niemela; J. Lehtonen
收藏 | 浏览/下载：128/0 | 提交时间：2013/02/05
Single-walled Carbon Nanotube Semiconducting Swnts Electron Diffraction Iron-copper Catalyst Preferential Growth Selective Synthesis Fe-cu Nanoparticles Spectroscopy Substrate Diameter Support Mgo |
| Tunable Reactive Wetting of Sn on Microporous Cu Layer 期刊论文
Journal of Materials Science & Technology, 2012, 卷号: 28, 期号: 4, 页码: 379-384
作者: Q. Q. Lai; L. Zhang; C. Chen; J. K. Shang
收藏 | 浏览/下载：86/0 | 提交时间：2013/02/05
Wetting Porous Material Soldering Copper Substrate Porous Copper Infiltration Kinetics Carbide Silicon |
| Progress of graphene growth on copper by chemical vapor deposition: Growth behavior and controlled synthesis 期刊论文
Chinese Science Bulletin, 2012, 卷号: 57, 期号: 23, 页码: 2995-2999
作者: L. P. Ma; W. C. Ren; Z. L. Dong; L. Q. Liu; H. M. Cheng
收藏 | 浏览/下载：100/0 | 提交时间：2013/02/05
Graphene Controlled Growth Chemical Vapor Deposition Copper Substrate Bilayer Graphene Layer Graphene Films Cu(111) Foils |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
收藏 | 浏览/下载：112/0 | 提交时间：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques 期刊论文
Applied Surface Science, 2010, 卷号: 256, 期号: 23, 页码: 7010-7017
作者: J. Ran; J. Z. Zhang; W. Q. Yao; Y. T. Wei
Adobe PDF(1098Kb) | 收藏 | 浏览/下载：143/0 | 提交时间：2012/04/13
Metal Film Polyimide Ion implantatIon Ion Beam Assisted depositIon Adhesion Assisted Deposition Adhesion Properties Copper-films Thin-film Implantation Limitations Substrate Polymers |
| A novel method of electroless plating on AZ31 magnesium alloy sheet 期刊论文
Journal of Materials Processing Technology, 2008, 卷号: 203, 期号: 1-3, 页码: 310-314
作者: H. Zhao; Z. H. Huang; J. Z. Cui
Adobe PDF(775Kb) | 收藏 | 浏览/下载：118/0 | 提交时间：2012/04/13
Organic Coating Interlayer Electroless Plating Copper Film Corrosion Copper Az91d Substrate Coatings Silver Films |
| Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder 期刊论文
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 6, 页码: 811-816
作者: J. J. Guo; L. Zhang; A. P. Xian; J. K. Shang
收藏 | 浏览/下载：86/0 | 提交时间：2012/04/13
Solderability Feni Alloys Lead-free Solders Wetting Electroless-nickel/solder Interface Enig Plating Layer Thermal-stability Sn-0.4cu Solder Cu Substrate Plated Kovar Sn Reflow Copper Part |
