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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：137/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：143/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者:  M. N. Wang;  J. Q. Wang;  W. Ke
收藏  |  浏览/下载：116/0  |  提交时间：2014/04/18
Lead-free Solders  3.5-percent Nacl Solution  Electrochemical Corrosion  Ga Solder  Reliability  Surface  Alloys  Joints  Tin  Sn  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：103/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere 期刊论文
Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2013, 卷号: 44A, 期号: 3, 页码: 1462-1474
作者:  Z. Yan;  A. P. Xian
收藏  |  浏览/下载：115/0  |  提交时间：2013/12/24
Lead-free Solders  Electrochemical Corrosion  Whisker Growth  Nacl  Solution  Thin-films  Tin  Oxidation  Behavior  Alloys  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：108/0  |  提交时间：2013/12/24
Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Corrosion Science, 2012, 卷号: 63, 页码: 20-28
作者:  M. N. Wang;  J. Q. Wang;  H. Feng;  W. Ke
收藏  |  浏览/下载：76/0  |  提交时间：2013/02/05
Electronic Materials  Alloy  Sem  Xps  Atmospheric Corrosion  Lead-free Solders  Ag-cu Alloys  Electrochemical Corrosion  Nacl  Solution  Tin  Behavior  Microstructure  Surface  
Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：91/0  |  提交时间：2013/02/05
Lead-free Solders  To-brittle Transition  Intermetallic Compounds  Deformation-behavior  Tensile Properties  Shear-strength  Sn  Sn-3.5ag  Tin  Cu  
Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168
作者:  H. F. Zhou;  J. D. Guo;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2013/02/05
Electroless Fe-ni  Under-bump Metallization  Interfacial Reaction  Lead-free Solders  Wetting Balance  Snagcu Solder  Cu  Joints  Solderability  Growth  Ag  
Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2012/04/13
Crack-growth-behavior  Lead-free Solders  Alpha-al2o3(0001)/cu(111)  Interface  Mechanical Strength  Reactive Interface  Molecular-dynamics  Joints  Cu3sn  Cu  1st-principles