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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：114/0  |  提交时间：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 8, 页码: 2500-2505
作者:  Ma Guofeng;  Zhang Hongling;  Sun Lina;  He Chunlin;  Zhang Bo;  Zhang Haifeng
收藏  |  浏览/下载：111/0  |  提交时间：2021/02/02
high entropy alloy  Bi-Sn molten alloy  wettability  interface  wetting mechanism  
Bi-Sn熔体在高熵合金上的润湿行为及界面特征 期刊论文
稀有金属材料与工程, 2018, 卷号: 47.0, 期号: 008, 页码: 2500-2505
作者:  马国峰;  张鸿龄;  孙俪娜;  贺春林;  张波;  张海峰
收藏  |  浏览/下载：144/0  |  提交时间：2021/02/02
高熵合金  Bi-Sn熔体  润湿  界面特征  润湿机制  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：107/0  |  提交时间：2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure  
High cycle fatigue of isothermally forged Ti-6.5Al-2.2Mo-2.2Zr-1.8Sn-0.7W-0.2Si with different microstructures 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 689, 页码: 114-122
作者:  Zhang, SF;  Zeng, WD;  Zhao, QY;  Gao, XX;  Wang, QJ;  Zeng, WD (reprint author), Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China.
收藏  |  浏览/下载：210/0  |  提交时间：2016/12/28
High Cycle Fatigue  Ti-6.5al-2.2mo-2.2zr-1.8sn-0.7w-0.2si  Equiaxed Microstructure  Bi-modal Microstructure  Full Lamellar Microstructure  
Solidification Behavior of Immiscible Alloys under the Effect of a Direct Current 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 10, 页码: 1027-1035
作者:  H. X. Jiang;  J. Z. Zhao;  J. He
收藏  |  浏览/下载：120/0  |  提交时间：2015/01/14
Rapid Directional Solidification  Direct Current  Finely Dispersed  Microstructure  Shell/core Structure  Current-carrying Conductors  Microstructure Evolution  Monotectic  Alloys  Miscibility Gap  Al-bi  Interfacial-tension  Electric-current  Pb Alloys  Nucleation  Sn  
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：118/0  |  提交时间：2013/02/05
Sn-bi Solder  Void  Cu3sn  Bi Segregation  Interfacial Embrittlement  Cu  Alloys  Solder Interconnect  Grain-boundaries  Single-crystal  Bismuth  Embrittlement  Segregation  Copper  Strength  
In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2037Kb)  |  收藏  |  浏览/下载：108/0  |  提交时间：2012/04/13
In Situ Observation  Shear  Creep-fatigue  Fracture  Sn-58bi Solder  Grain-boundary Sliding  Lead-free Solders  Sn-bi  Microstructure Evolution  Tensile Properties  Alloys  Deformation  Technology  Metals  Ag  
Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328
作者:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2314Kb)  |  收藏  |  浏览/下载：97/0  |  提交时间：2012/04/13
Sn-bi Solder  Bi Segregation  Interfacial Embrittlement  Substrate  Alloying  Reflow Temperature  Tensile Strength  Lead-free Solders  Joints  Microstructure  Embrittlement  Interconnect  Bismuth  Ag  
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P;  Liu C Z
收藏  |  浏览/下载：112/0  |  提交时间：2021/02/26
SN-AG  CU SUBSTRATE  INTERFACIAL REACTIONS  MICROSTRUCTURE  COPPER  BI  TEMPERATURE  STRENGTH  ALLOYS  JOINTS  Solder  Interfacial reaction  Intermetallics  Kinetics