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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：110/0  |  提交时间：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：106/0  |  提交时间：2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure  
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：115/0  |  提交时间：2013/02/05
Sn-bi Solder  Void  Cu3sn  Bi Segregation  Interfacial Embrittlement  Cu  Alloys  Solder Interconnect  Grain-boundaries  Single-crystal  Bismuth  Embrittlement  Segregation  Copper  Strength  
In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2037Kb)  |  收藏  |  浏览/下载：107/0  |  提交时间：2012/04/13
In Situ Observation  Shear  Creep-fatigue  Fracture  Sn-58bi Solder  Grain-boundary Sliding  Lead-free Solders  Sn-bi  Microstructure Evolution  Tensile Properties  Alloys  Deformation  Technology  Metals  Ag  
Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328
作者:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2314Kb)  |  收藏  |  浏览/下载：96/0  |  提交时间：2012/04/13
Sn-bi Solder  Bi Segregation  Interfacial Embrittlement  Substrate  Alloying  Reflow Temperature  Tensile Strength  Lead-free Solders  Joints  Microstructure  Embrittlement  Interconnect  Bismuth  Ag  
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P;  Liu C Z
收藏  |  浏览/下载：110/0  |  提交时间：2021/02/26
SN-AG  CU SUBSTRATE  INTERFACIAL REACTIONS  MICROSTRUCTURE  COPPER  BI  TEMPERATURE  STRENGTH  ALLOYS  JOINTS  Solder  Interfacial reaction  Intermetallics  Kinetics  
Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(2393Kb)  |  收藏  |  浏览/下载：102/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Lead-free Solder  Intermetallic Compounds  (Imcs)  Growth Kinetics  Local Cracks  Lead-free Solders  Electroless Ni(p) Metallization  Intermetallic  Compound  Cu-sn  Joints  Ni  Bi  Nanoindentation  Microstructure  Wt.percent  
Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文
Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(797Kb)  |  收藏  |  浏览/下载：121/0  |  提交时间：2012/04/13
Sn-ag-zn  Lead-free Solder  Gravity  Interfaces  Intermetallic Compounds  Lead-free Solders  Cu Substrate  Bump Metallization  Tensile Properties  Phase-equilibria  Eutectic Alloy  Ni  Behavior  Bi  Microstructure  
Current-induced phase partitioning in eutectic indium-tin pb-free solder interconnect 期刊论文
Journal of Electronic Materials, 2007, 卷号: 36, 期号: 10, 页码: 1372-1377
作者:  J. P. Daghfal;  J. K. Shang
收藏  |  浏览/下载：109/0  |  提交时间：2012/04/13
In-sn Solder  Electromigration  Current Stressing  Hillocks  Interface  Mechanical-properties  Microstructure  Joints  Electromigration  Creep  Bi  
Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure 期刊论文
Journal of Electronic Materials, 2005, 卷号: 34, 期号: 1, 页码: 62-67
作者:  Q. L. Zeng;  Z. G. Wang;  A. P. Xian;  J. K. Shang
收藏  |  浏览/下载：70/0  |  提交时间：2012/04/14
Lead-free Solder  Low-cycle Fatigue  Cyclic Softening  Sn-3.8ag-0.7cu  Alloy  Sn-ag-cu  Fatigue Behavior  Bi