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A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文
MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  An, Xizhong
收藏  |  浏览/下载：124/0  |  提交时间：2021/10/15
Lead-free solder  Thin films  Oxidation  Corrosion  X-ray photoelectron spectroscopy (XPS)  
High electrocaloric effect in barium titanate-sodium niobate ceramics with core-shell grain assembly 期刊论文
JOURNAL OF MATERIOMICS, 2020, 卷号: 6, 期号: 3, 页码: 618-627
作者:  Zhang, Chao;  Du, Quanpei;  Li, Wenru;  Su, Dong;  Shen, Meng;  Qian, Xiaoshi;  Li, Bing;  Zhang, Haibo;  Jiang, Shenglin;  Zhang, Guangzu
收藏  |  浏览/下载：148/0  |  提交时间：2021/02/02
Electrocaloric effect  Core-shell structure  Lead-free ceramics  Internal stress  High temperature stability  
High electrocaloric effect in barium titanate-sodium niobate ceramics with core-shell grain assembly 期刊论文
JOURNAL OF MATERIOMICS, 2020, 卷号: 6, 期号: 3, 页码: 618-627
作者:  Zhang, Chao;  Du, Quanpei;  Li, Wenru;  Su, Dong;  Shen, Meng;  Qian, Xiaoshi;  Li, Bing;  Zhang, Haibo;  Jiang, Shenglin;  Zhang, Guangzu
收藏  |  浏览/下载：188/0  |  提交时间：2021/02/02
Electrocaloric effect  Core-shell structure  Lead-free ceramics  Internal stress  High temperature stability  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：119/0  |  提交时间：2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：132/0  |  提交时间：2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
收藏  |  浏览/下载：191/0  |  提交时间：2021/02/02
Lead-free solder  reliability  IMC  crack  failure  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：136/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Monoclinic (K,Na)NbO3 Ferroelectric Phase in Epitaxial Films 期刊论文
WILEY, 2017, 卷号: 3, 期号: 10, 页码: -
作者:  Luo, Jin;  Sun, Wei;  Zhou, Zhen;  Lee, Hyun-Young;  Wang, Ke;  Zhu, Fangyuan;  Bai, Yu;  Wang, Zhan Jie;  Li, Jing-Feng;  Li, JF (reprint author), Tsinghua Univ, Sch Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China.
收藏  |  浏览/下载：150/0  |  提交时间：2018/01/10
Ferroelectrics  Lead-free Piezoelectrics  Monoclinic Phase  Phase Transitions  Polarization Rotation  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
作者:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
收藏  |  浏览/下载：127/0  |  提交时间：2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：106/0  |  提交时间：2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure