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Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：257/0  |  提交时间：2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：136/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
作者:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
收藏  |  浏览/下载：129/0  |  提交时间：2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：136/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：143/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
作者:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：88/0  |  提交时间：2013/02/05
Solder Joint  Interfaces  Intermetallic Compounds  Fracture  Shear  Strength  Lead-free Solder  Brazed Joints  Size  Sn  Microstructure  Deformation  Reliability  Failure  Copper  Cu  
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2506-2515
作者:  J. P. Daghfal;  P. J. Shang;  Z. Q. Liu;  J. K. Shang
Adobe PDF(631Kb)  |  收藏  |  浏览/下载：129/0  |  提交时间：2012/04/13
In-sn Solder  Ni-fe Metallization  Interface  Fesn(2)  Ni(3)Sn(4)  Faceting  In-48sn Solder  In-49sn Solder  Reflow Process  Microstructure  Substrate  Packages  Kinetics  Alloy  Joint  Ag  
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
作者:  X. N. Du;  J. D. Guo;  J. K. Shang
Adobe PDF(656Kb)  |  收藏  |  浏览/下载：65/0  |  提交时间：2012/04/13
Electromigration  Solder Joint  Intermetallic Compound  Lead-free Solders  Alloy  Interconnects  Technology  Bump