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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：114/0  |  提交时间：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
作者:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：177/0  |  提交时间：2021/02/02
Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
作者:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：148/0  |  提交时间：2021/02/02
Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：237/0  |  提交时间：2021/02/02
alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：136/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：137/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：112/0  |  提交时间：2017/08/17
Cu6sn5 Whiskers  Ag3sn Fibers  Mechanical Property  Screw Dislocation  
Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan
收藏  |  浏览/下载：145/0  |  提交时间：2021/02/02
Alloys  Sn-Ag-Cu  Finite element modeling (FEM)  Reliability  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：136/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles