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A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文
MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  An, Xizhong
收藏  |  浏览/下载：124/0  |  提交时间：2021/10/15
Lead-free solder  Thin films  Oxidation  Corrosion  X-ray photoelectron spectroscopy (XPS)  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：118/0  |  提交时间：2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：131/0  |  提交时间：2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
收藏  |  浏览/下载：190/0  |  提交时间：2021/02/02
Lead-free solder  reliability  IMC  crack  failure  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
作者:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
收藏  |  浏览/下载：127/0  |  提交时间：2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：106/0  |  提交时间：2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure  
Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 卷号: 646, 页码: 405-411
作者:  Zhang, Q. K.;  Long, W. M.;  Zhang, Z. F.;  qkzhang@alum.imr.ac.cn;  zhfzhang@imr.ac.cn
收藏  |  浏览/下载：113/0  |  提交时间：2016/04/21
Lead-free Solder  Intermetallic Compounds  3d Imaging  Thermal Aging  Grain Boundary  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：139/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者:  M. N. Wang;  J. Q. Wang;  W. Ke
收藏  |  浏览/下载：113/0  |  提交时间：2014/04/18
Lead-free Solders  3.5-percent Nacl Solution  Electrochemical Corrosion  Ga Solder  Reliability  Surface  Alloys  Joints  Tin  Sn  
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
收藏  |  浏览/下载：100/0  |  提交时间：2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum